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Ceramic PCB Manufacturers

We now have a highly efficient crew to deal with inquiries from clients. Our intention is "100% shopper pleasure by our merchandise quality, price tag & our staff service" and take pleasure in a very good standing amongst purchasers. With quite a few factories, we can easily provide a wide vary of Ceramic PCB,Double-sided copper based PCB,Thermoelectric separation of copper based PCB, Great top quality, competitive prices, prompt delivery and dependable services are guaranteed Kindly let's know your quantity requirement under each size category so that we can inform you accordingly.
Ceramic PCB, With a wide range, good quality, reasonable prices and stylish designs, our goods are extensively used in beauty and other industries. Our items are widely recognized and trusted by users and can meet continuously changing economic and social needs.

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  • XC7S25-2CSGA225I

    XC7S25-2CSGA225I

    XC7S25-2CSGA225I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066K3F40I2LG

    10AX066K3F40I2LG

    10AX066K3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU3P-2FFVB676E

    XCKU3P-2FFVB676E

    ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,
  • XC7A100T-1FGG484I

    XC7A100T-1FGG484I

    XC7A100T-1FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-370 HDI PCB

    EM-370 HDI PCB

    EM-370 HDI PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
  • XC6SLX16-3FTG256C

    XC6SLX16-3FTG256C

    XC6SLX16-3FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

  • Development of integrated circuits

    The most advanced integrated circuit is the core of microprocessor or multi-core processor, which can control everything from computer to mobile phone to digital microwave oven. Although the cost of designing and developing a complex

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    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

  • What is semiconductor

    There are many forms of matter, such as solid, liquid, gas, plasma and so on. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics and so on, insulators. Metals with good conductivity, such as gold, silver, copper, iron, tin and aluminum, are called conductors. The material between conductor and insulator can be simply called semiconductor. Compared with conductors and insulators, the discovery of semiconductor materials is the latest. Until the 1930s, when the purification technology of materials was improved, the existence of semiconductors was really recognized by the academic community.

  • 5G base stations require high-frequency and high-speed circuits, PCB has become a popular product line in the 5G era

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  • The introduction of the high speed board

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