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    Ro4003CLoPro PCB

    The harmonic frequency of the signal edge is higher than the frequency of the signal itself, which is the unintended result of the signal transmission caused by the rapidly changing rising and falling edges (or signal jumps) of the signal. Therefore, it is generally agreed that if the line propagation delay is greater than the rise time of the 1/2 digital signal drive terminal, such signals are considered to be high-speed signals and produce transmission line effects. The following is about Ro4003CLoPro PCB related, I hope to help you better understand Ro4003CLoPro PCB.
  • XC7K160T-2FFG676C

    XC7K160T-2FFG676C

    XC7K160T-2FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 18 layer 3step HDI PCB

    18 layer 3step HDI PCB

    18 layer 3step HDI PCB refers to the HDI circuit board with more than 2 levels, usually 3 + N + 3 or 4 + N + 4 or 5 + N + 5 structure. The blind hole uses a laser, and the hole copper is about 15UM.The following is about 18 layer 3step HDI circuit board related, I hope to help you better understand 18 layer 3step HDI circuit board.
  • XCVU5P-3FLVC2104E

    XCVU5P-3FLVC2104E

    ​XCVU5P-3FLVC2104E is a high-performance FPGA product launched by Xilinx, belonging to the UltraScale+series. This FPGA has the following features and specifications:
  • XC6VHX250T-2FFG1154I

    XC6VHX250T-2FFG1154I

    XC6VHX250T-2FFG1154I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCR3032XL-10VQG44I

    XCR3032XL-10VQG44I

    XCR3032XL-10VQG44I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • Precautions for the use of high-speed board plates you must know

    With the rapid development of electronic design and communication fields and the application of cloud computing, products have higher and higher requirements for data volume, and data transmission rates are getting faster and faster. At the same time, the performance of high-speed plates that carry data transmission is also required to be higher and higher.So what should be paid attention to when using high-speed plates?

  • Welding process of FPC circuit board

    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding

  • Current situation of domestic chips

    What is the current situation and trend of chip development in China? Now let's have a look

  • Introduction to semiconductor

    Germanium, silicon, selenium, gallium arsenide and many metal oxides, metal sulfides and other objects, whose conductivity is between conductor and insulator, are called semiconductors. Semiconductors have some special properties. For example, the thermistor (thermistor) for automatic control can be made by using the relationship between the resistivity and temperature of the semiconductor; Using its photosensitive characteristics, photosensitive elements for automatic control can be made, such as photocells, photocells and photoresistors

  • How to distinguish PCB single-layer board and multi-layer board

    According to the number of layers, there are three types of single-sided, double-sided, and multi-layer circuit boards, which are distinguished according to the circuit layers inside.

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