AP7164E Rigid-Flex PCB Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate inside our success for AP7164E Rigid-Flex PCB,Rigid-Flex PCB,FPC,PCB Circuit board,AP7156E Rigid-Flex PCB, We goal at Ongoing system innovation, management innovation, elite innovation and sector innovation, give full play for the overall advantages, and constantly make improvements to support excellent.
AP7164E Rigid-Flex PCB, Our company regards "reasonable prices, high quality,efficient production time and good after-sales service" as our tenet. We hope to cooperate with more customers for mutual development and benefits in future. Welcome to contact us.

Hot Products

  • BCM56465B0KFSBG

    BCM56465B0KFSBG

    BCM56465B0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM59101BKMLG

    BCM59101BKMLG

    BCM59101BKMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX180KF40C3N

    EP4SGX180KF40C3N

    EP4SGX180KF40C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • XCZU15EG-1FFVC900I

    XCZU15EG-1FFVC900I

    XCZU15EG-1FFVC900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XAZU2EG-1SFVA625Q

    XAZU2EG-1SFVA625Q

    XAZU2EG-1SFVA625Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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