30OZ Heavy copper PCB Manufacturers

Our products are greatly recognized and trustworthy by users and will fulfill continually shifting economic and social requires for 30OZ Heavy copper PCB,Heavy copper PCB,28OZ Heavy copper PCB,20OZ Heavy copper PCB,18OZ Heavy copper PCB, We adhere on the tenet of "Services of Standardization, to meet Customers' Demands".
30OZ Heavy copper PCB, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

Hot Products

  • XC7S50-1FTGB196C

    XC7S50-1FTGB196C

    XC7S50-1FTGB196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU27DR-1FFVE1156I

    XCZU27DR-1FFVE1156I

    XCZU27DR-1FFVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU115-3FLVA1924E

    XCKU115-3FLVA1924E

    The XCKU115-3FLVA1924E architecture includes high-performance FPGA, MPSoC, and RFSoC series, which can meet a wide range of application requirements. System requirements, with a focus on reducing total power consumption through numerous innovative technologies
  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • XC7VX415T-2FFG1158I

    XC7VX415T-2FFG1158I

    ​XC7VX415T-2FFG1158I Field Programmable Gate Array (FPGA) is a device that uses stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • EP1C12F324C8N

    EP1C12F324C8N

    EP1C12F324C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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