16-Layer FPGA PCB Manufacturers

Our company promises all users of the first-class products and the most satisfying post-sale service. We warmly welcome our regular and new customers to join us for 16-Layer FPGA PCB,FPGA PCB,28-Layer FPGA PCB,20-Layer FPGA PCB, we could solve our customer problems asap and do the profit for our customer. For those who need excellent company and top quality , pls choose us , thanks !
16-Layer FPGA PCB, Our goods are produced with the best raw materials. Every moment, we constantly improve the production programme. In order to ensure better quality and service, we have been focusing on the production process. We have now got high praise by partner. We're looking forward to establishing business relationship with you.

Hot Products

  • EPM7128AETC100-10N

    EPM7128AETC100-10N

    EPM7128AETC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S400-4FTG256C

    XC3S400-4FTG256C

    XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCV300-4BG432C

    XCV300-4BG432C

    XCV300-4BG432C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPF6016QC208-2N

    EPF6016QC208-2N

    EPF6016QC208-2N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TU-883 PCB

    TU-883 PCB

    TU-883 PCB The branch length in high-speed TTL circuits should be less than 1.5 inches. This topology takes up less wiring space and can be terminated with a single resistor match. However, this wiring structure makes the signal reception at different signal receiving ends asynchronous. The following is about 6mm Thick TU883 High speed Backplane related, I hope to help you better understand 6mm Thick TU-883 PCB.
  • MT47H64M8SH-25E:H

    MT47H64M8SH-25E:H

    ​MT47H64M8SH-25E:H is a type of synchronous dynamic random-access memory (SDRAM) chip produced by Micron Technology. It has a capacity of 512 megabytes (MB) and a maximum clock speed of 200 megahertz (MHz). The chip operates at a voltage of 2.5

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