12 layer 3Step HDI PCB Manufacturers

Adhering into the theory of "quality, services, efficiency and growth", now we have gained trusts and praises from domestic and international shopper for 12 layer 3Step HDI PCB,10 layer 3Step HDI PCB,8 layer 2Step HDI PCB, Our really specialized process eliminates the component failure and offers our shoppers unvarying top quality, allowing us to control cost, plan capacity and maintain consistent on time delivery.
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Hot Products

  • 10M50DAF484C8G

    10M50DAF484C8G

    ​The 10M50DAF484C8G device is a single chip, non-volatile low-cost programmable logic device (PLD) used to integrate the best set of system components.
  • LTM4628EV#PBF

    LTM4628EV#PBF

    ​LTM4628EV#PBF also supports frequency synchronization, multi-phase operation, burst mode operation, and output voltage tracking functions for power rail sorting. It adopts a space saving design while having good heat resistance, and the pin coating complies with SnPb (BGA) or RoHS standards.
  • HI-8586PST

    HI-8586PST

    HI-8586PST is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-3FLGC2104E

    XCVU11P-3FLGC2104E

    ​XCVU11P-3FLGC2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale+series. This chip has been widely used in fields such as data centers, network communication, video and image processing due to its high performance, low power consumption, and flexibility.
  • XC3S1400A-4FGG484C

    XC3S1400A-4FGG484C

    ​XC3S1400A-4FGG484C is an FPGA (Field Programmable Gate Array) produced by Xilinx, with the following features and specifications:
  • XC2S300E-6FG456C

    XC2S300E-6FG456C

    XC2S300E-6FG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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