Al2O3 PCB has excellent corrosion resistance, and has high thermal conductivity, excellent chemical stability and thermal stability, and other properties that organic substrates do not have. Aluminum Nitride Ceramic base board an ideal packaging material for a new generation of large-scale integrated circuits and power electronic modules. The following is about Al2O3 PCB I hope to help you better understand Al2O3 PCB.
High-power LED ceramic PCB--High-power LED copper-clad ceramic circuit board can effectively solve the heat dissipation problem of high-power LED thermal skew,Aluminum Nitride Ceramic base board substrate has the best overall performance and is the ideal substrate material for future high-power LEDs.
Thin film circuit board has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.
Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
In the era of rapid development of interconnected data and optical networks, 100G optical modules PCB , 200G optical modules PCB and even 400G optical modules PCB are constantly emerging. However, high speed has the advantages of high speed, and low speed also has the advantages of low speed. In the era of high-speed optical modules, 10G optical module PCB support the operations of manufacturers and users with their unique advantages and relatively low cost.10G optical module, as the name suggests, is an optical module that transmits 10G of data per second.According to inquiries: 10G optical modules are packaged in 300pin, XENPAK, X2, XFP, SFP+, and other packaging methods.
AIN PCB have excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxicity, and thermal expansion coefficient matching with Si. AIN PCB will gradually replace traditional high-power LED base material and become A ceramic substrate material with the most future development. The most suitable heat dissipation substrate for AIN PCB
