TU-668 PCB Manufacturers

XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications

XCZU67DR-L2FFVE1156I belongs to the Zynq-7000 series of XILINX, which is a high-performance programmable system level chip (SoC) that integrates ARM processors and FPGA (Field Programmable Gate Array) structures, suitable for various high-performance and high complexity applications such as embedded systems, multimedia processing, and wireless communication

XC3S4000-4FG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.

​The XC7K480T-2FFG901I FPGA is an ideal choice for applications such as 3G/4G wireless, flat panel displays, and video over IP solutions. The Kinex? 7 FPGA allows designers to achieve excellent cost/performance/power balance at 28nm nodes, while providing high DSP rate, cost-effective packaging, and supporting PCIe ® Mainstream standards such as Gen3 and 10 Gigabit Ethernet.

BCM95719A1904AC is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.