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Hot Products

  • 5SGXEA4H2F35I3G

    5SGXEA4H2F35I3G

    ​5SGXEA4H2F35I3G is an FPGA (Field Programmable Gate Array) product produced by Altera Corporation. This FPGA is packaged in 1152-BGA and features high performance, low power consumption, and flexible programmability, making it suitable for various application scenarios. Specifically, 5SGXEA4H2F35I3G has the following characteristics and advantages:
  • EP4SGX230FF35C4G

    EP4SGX230FF35C4G

    EP4SGX230FF35C4G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • AP9111R Rigid-Flex PCB

    AP9111R Rigid-Flex PCB

    The AP9111R Rigid-Flex PCB combines the advantages of the rigid characteristics of the rigid circuit board and the bendable characteristics of the flexible board, so that the PCB is no longer a two-dimensional plane layer of oil, but is folded by a three-dimensional internal connection and arbitrary bending. The following is about 12 Layer 8R4F Rigid Flex Board related, I hope to help you better understand 12 Layer AP9111R Rigid-Flex PCB.
  • XA7Z020-1CLG400Q

    XA7Z020-1CLG400Q

    XA7Z020-1CLG400Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Bluetooth Module HDI PCB

    Bluetooth Module HDI PCB

    Bluetooth module is a PCBA board with integrated Bluetooth function for short-range wireless communication. It is divided into Bluetooth data module and Bluetooth voice module by function.The following is about Bluetooth Module HDI PCB related, I hope to help you better understand Bluetooth Module HDI PCB.
  • High-power LED ceramic PCB

    High-power LED ceramic PCB

    High-power LED ceramic PCB--High-power LED copper-clad ceramic circuit board can effectively solve the heat dissipation problem of high-power LED thermal skew,Aluminum Nitride Ceramic base board substrate has the best overall performance and is the ideal substrate material for future high-power LEDs.

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