AD600 PCB Manufacturers

To become the stage of realizing dreams of our employees! To build a happier, more united and extra professional workforce! To reach a mutual advantage of our prospects, suppliers, the society and ourselves for AD600 PCB,Arlon PCB,PTFE PCB,Teflon PCB,AD250C PCB, We have been also the appointed OEM factory for several worlds' famous merchandise brands. Welcome to speak to us for more negotiation and cooperation.
AD600 PCB, We mainly sell in wholesale, with the most popular and easy ways of making payment, which are paying via Money Gram, Western Union, Bank Transfer and Paypal. For any further talk, just feel free to contact our salesmen, who are really good and knowledgeable about our prodcuts.

Hot Products

  • XC6SLX9-2TQG144C

    XC6SLX9-2TQG144C

    XC6SLX9-2TQG144C is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 9,152 Logic Cells, operates at a speed of up to 250 MHz, and features 576 Kbit of Block RAM, and 72 DSP Slices.
  • EP2AGX95EF29I3G

    EP2AGX95EF29I3G

    EP2AGX95EF29I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5AGXMA5G4F31C5G

    5AGXMA5G4F31C5G

    ​5AGXMA5G4F31C5G is an electronic component produced by Intel (or possibly another brand ALTERA, but it should be noted that it is more common in Intel's product line)
  • 28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.
  • EP2C35F672C8N

    EP2C35F672C8N

    EP2C35F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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