20OZ Heavy copper PCB Manufacturers

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Hot Products

  • XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.
  • XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-3210PQI

    HI-3210PQI

    HI-3210PQI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT41K128M16JT-125AAT:K

    MT41K128M16JT-125AAT:K

    ​MT41K128M16JT-125AAT:K is a type of dynamic random-access memory (DRAM) module commonly used in computer systems. It has a capacity of 2 GB and a data transfer rate of 1600 megatransfers per second (MT/s).
  • XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.
  • 28OZ Heavy copper PCB

    28OZ Heavy copper PCB

    28OZ Heavy copper PCB Ultra-thick copper multilayer printed boards are generally special types of printed circuit boards. The main features of such printed circuit boards are 4-12 layers, the inner layer copper thickness is greater than 10OZ, and the quality is high. The following is about 28OZ Heavy Copper Board related, I hope to help you better understand 28OZ Heavy Copper Board.

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