18G High-speed PCB Manufacturers

The key to our success is "Good Solution Top quality, Reasonable Value and Efficient Service" for 18G High-speed PCB,5G test PCB,5G PCB,6G High-speed PCB,8G High-speed PCB, Seeing believes! We sincerely welcome the new clients overseas to setup business enterprise interactions and also be expecting to consolidate the relationships while using the long-established prospects.
18G High-speed PCB, There are advanced producing & processing equipment and skilled workers to ensure the merchandise with high quality. We now have found an excellent before-sale, sale, after-sale service to ensure the customers that could rest assured to make orders. Until now our goods are now moving on fast and very popular in South America, East Asia, the Middle east, Africa, etc.

Hot Products

  • XC6SLX9-2TQG144C

    XC6SLX9-2TQG144C

    XC6SLX9-2TQG144C is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 9,152 Logic Cells, operates at a speed of up to 250 MHz, and features 576 Kbit of Block RAM, and 72 DSP Slices.
  • EP2AGX95EF29I3G

    EP2AGX95EF29I3G

    EP2AGX95EF29I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5AGXMA5G4F31C5G

    5AGXMA5G4F31C5G

    ​5AGXMA5G4F31C5G is an electronic component produced by Intel (or possibly another brand ALTERA, but it should be noted that it is more common in Intel's product line)
  • 28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.
  • EP2C35F672C8N

    EP2C35F672C8N

    EP2C35F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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