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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.
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  • XCZU11EG-3FFVC1760E integrates feature rich 64 bit quad core or dual core Arm in a single device ® Cortex-A53 processing system and programmable logic UltraScale architecture based on dual core Arm Cortex-R5F. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.

  • XCZU47DR-L2FFVG1517I Xilinx XC7A100T-2FGG676I Can achieve higher cost-effectiveness in multiple aspects, including logic, signal processing, embedded memory, LVDS I/O, memory interfaces, and transceivers. Artix-7 FPGAs are perfect for cost sensitive applications that require high-end functionality.

  • ​The XCZU15EG-2FFVB1156I chip is equipped with 26.2 Mbit embedded memory and 352 input/output terminals. 24 DSP transceiver, capable of stable operation at 2400MT/s. There are also 4 10G SFP+fiber optic interfaces, 4 40G QSFP fiber optic interfaces, 1 USB 3.0 interface, 1 Gigabit network interface, and 1 DP interface. The board has a self-control power on sequence and supports multiple startup mode

  • As a member of the FPGA chip, XCVU9P-2FLGA2104I has 2304 programmable logic units (PLs) and 150MB of internal memory, providing a clock frequency of up to 1.5 GHz. Provided 416 input/output pins and 36.1 Mbit distributed RAM. It supports field programmable gate array (FPGA) technology and can achieve flexible design for various applications

  • ​XCKU060-2FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.

  • ​The XCVU065-2FFVC1517I device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.

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