Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
Ro4835LoPro PCB--For the processing of high cost performance SIW circuits, another advantage of using ro4835blopro and ro4835lopro materials is that the processing cost can be reduced through the standard FR-4 epoxy / glass process.
As an industry leader in the field of electronic materials, Rogers RT5880 material has been providing advanced materials with high performance and high reliability in the fields of consumer electronics, power electronics and communication infrastructure.
77G Millimeter wave PCB is disassembled and analyzed. The working principle of millimeter wave radar is to transmit millimeter wave outward through antenna and receive the reflected signal of target. By comparing and processing the signal, the classification and recognition of target is completed. Different from lidar, the price reduction space of this part depends on the price strategies of several tie 1 companies. In fact, the living space of this component in China is very narrow.
Rogers PCB Rogers is the name of a company. His boards are mostly used for high frequency PCB production. Models include ro4350b, ro4003c, ro4835, ro3003, ro3010, ro3210, rt5880, rt6002, rt6010, tmm4, tmm6, tmm10i, etc
Ro4003c high frequency PCB--High frequency of electronic equipment is the development trend, especially in the development of wireless network and satellite communication, information products tend to be high-speed and high-frequency, and communication products are moving towards the standardization of voice, video and data of wireless transmission with large capacity and high speed. Therefore, high-frequency substrate is required for the new generation of products.
