Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
FR-5 PCB epoxy board is made of special electronic cloth soaked with epoxy phenolic resin and other materials by high temperature and high pressure hot pressing. It has high mechanical and dielectric properties, good insulation, heat and moisture resistance, and good machinability
The Inlaid Copper Coin PCB is inlaid in the FR4, so as to achieve the function of heat dissipation of a certain chip. Compared with ordinary epoxy resin, the effect is remarkable.
It has a number of leading technologies in the industry, including: the first uses a 0.13 micron manufacturing process, has 1GHz speed DDRII memory, perfectly supports Direct X9, and so on.The following is about High speed Graphics Card PCB related, I hope to help you better understand High speed Graphics Card PCB.
