XC7K160T-2FFG676I is a BGA chip launched by XILINX, category: Embedded-FPGA (Field Programmable Gate Array), brand: XILINX, original authentic, stock in stock
BGA is a small package on a pcb circuit board, and BGA is a packaging method in which an integrated circuit uses an organic carrier board.The following is about 8 layers EM-890 PCB, I hope to help you better understand 8 layers EM-890 PCB.
Any Layer Inner Via Hole,The arbitrary interconnection between layers can meet the wiring connection requirements of high-density HDI boards. Through the setting of thermally conductive silicone sheets, the circuit board has good heat dissipation and shock resistance.The following is about 6 layers ELIC HDI PCB, I hope to help you better understand 6 layers ELIC HDI PCB.